Catalytic NOx Reduction for Semiconductor Industry

Secondary waste gas treatment for maximum reduction of nitrogen oxide emissions following burn-wet and other NOx-generating abatement systems.

Secondary Waste Gas Treatment for Highest Environmental Standards

Modern burn-wet systems reliably remove a wide range of hazardous process gases. At the same time, this process can result in the formation of nitrogen oxides (NOx), which are subject to increasingly stringent environmental regulations. Catalytic after-treatment offers an efficient solution for specifically reducing NOx emissions.

A large, industrial white cabinet system with purple accents, labeled "TSUGA," featuring multiple doors and a digital control panel, designed for waste gas abatement.

TSUGA – The Practical Implementation

TSUGA combines Selective Catalytic Reduction (SCR) with highly efficient particulate filtration. The system is used as a downstream bay solution and reliably reduces nitrogen oxides and particulate matter without affecting the operation of the upstream waste gas treatment systems.

The image shows a white industrial cabinet on the left side and two boxes on the right side with multiple control panels, featuring a high-tech interface and labeled components to be used in a manufacturing setting.

ALCEA – Advanced Catalytic Oxidation

ALCEA is a highly efficient secondary abatement system for reducing NOx emissions in semiconductor manufacturing. Based on plasma-enhanced catalytic technology, it achieves NOx reduction efficiencies of up to 95% with minimal energy consumption. Integrated directly into the exhaust duct, ALCEA has virtually no footprint and can be easily retrofitted into existing subfab infrastructure.