TSUGA – Bay Solution with Multifunctionality
TSUGA is the stand-alone solution for secondary waste gas treatment of NOx and particulate matter in the semiconductor industry.
TSUGA – Secondary Waste Gas Treatment of NOx and Particulate Matter
DAS EE‘s Catalytic Systems represent an advanced solution for the semiconductor industry, offering superior performance in waste gas aftertreatment by harnessing the power of Selective Catalytic Reduction (SCR) with ammonia for DeNOx and fine dust removal through a highly efficient membrane filter. The catalytic system ensures exceptional reduction efficiency with minimal energy consumption by recovery of more than 80% of the process heat. With the advanced, reliable, and environmentally friendly solution, you can stay ahead of environmental regulations and achieve your sustainability goals.
NOx Reduction in the Semiconductor Industry: Innovative Solutions for Waste Gas Treatment
How are nitrogen oxides (NOx) formed, what impact do they have on the environment, and how can TSUGA help reduce NOx and particle emissions? Find out more in the following video.
Optimise Your Waste Gas Treatment with TSUGA
Our catalytic systems as a highly efficient secondary waste gas treatment downstream of NOx-generating burn-wet or plasma-wet abatement systems.
TSUGA – Technical Data and Configuration Options
TSUGA
TSUGA combines selective catalytic reduction (SCR) with ammonia for highly effective NOx reduction of up to 95% and a membrane filter for almost complete removal of particulate matter (up to 99.9%). The system is characterised by low energy consumption thanks to heat recovery and flexible operation at high volume flows without affecting upstream systems.
Selective catalytic reduction (SCR) converts NOx into harmless nitrogen and water through a catalytic reaction with ammonia. The process achieves high reduction efficiency regardless of the NOx source. SCR enables flexible application for NO and NO2 with low energy consumption and minimal NH3 emissions through precise dosing. Influencing factors include reagent type, mixing ratio, temperature and potential catalyst poisoning (e.g. by SO2, SO3, HF, heavy metals).
